Method and apparatus of power ring positioning to minimize...

Details Method and apparatus of power ring positioning to minimize... Method and apparatus of power ring positioning to minimize...

2006-10-31

2009-08-04

Pham, Hoai v (Department: 2892)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S617000, C257SE21508

Reexamination Certificate

active

07569472

ABSTRACT:
A method and/or an apparatus of power ring positioning to minimize crosstalk are disclosed. In one embodiment, a method includes generating an array of fingers between a power ring and a die, applying a signal wire between a bond pad of the die and a particular finger of the array of fingers, and applying a shielding wire between an adjacent bond pad and the power ring, such that the shielding wire is longer than the signal wire and does not couple to any of the array of fingers. The shielding wire may be placed between adjacent ones of the signal wire to minimize crosstalk between the adjacent ones of the signal wire.

REFERENCES:
patent: 6765301 (2004-07-01), Wu et al.

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