Abrading – Precision device or process - or with condition responsive... – Computer controlled
Reexamination Certificate
2006-02-21
2006-02-21
Nguyen, George (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
Computer controlled
C451S006000, C451S008000, C451S011000, C451S041000
Reexamination Certificate
active
07001242
ABSTRACT:
A polishing system can have a rotatable platen, a polishing pad secured to the platen, a carrier head to hold a substrate against the polishing pad, and an eddy current monitoring system including a coil or ferromagnetic body that extends at least partially through the polishing pad. A polishing pad can have a polishing layer and a coil or ferromagnetic body secured to the polishing layer. Recesses can be formed in a transparent window in the polishing pad.
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Birang Manoocher
Kim Hyeong Cheol
Swedek Boguslaw A.
Applied Materials Inc.
Fish & Richardson
Nguyen George
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