Etching a substrate: processes – Nongaseous phase etching of substrate – With measuring – testing – or inspecting
Reexamination Certificate
2005-10-04
2005-10-04
Hassanzadeh, Parviz (Department: 1763)
Etching a substrate: processes
Nongaseous phase etching of substrate
With measuring, testing, or inspecting
C216S088000, C451S001000, C156S345130
Reexamination Certificate
active
06951624
ABSTRACT:
A system for processing a wafer is provided. The system includes a chemical mechanical planarization (CMP) tool. The CMP tool includes a wafer carrier defined within a housing. A carrier film is affixed to the bottom surface and supports a wafer. A sensor embedded in the wafer carrier. The sensor is configured to induce an eddy current in the wafer to determine a proximity and a thickness of the wafer. A sensor array external to the CMP tool is included. The sensor array is in communication with the sensor embedded in the wafer carrier and substantially eliminates a distance sensitivity. The sensor array provides an initial thickness of the wafer to allow for a calibration to be performed on the sensor embedded in the wafer carrier. The calibration offsets variables causing inaccuracies in the determination of the thickness of the wafer during CMP operation. A method and an apparatus are also provided.
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Bright Nicolas J.
Gotkis Yehiel
Hemker David
Kistler Rodney
Owczarz Aleksander
Hassanzadeh Parviz
Lam Research Corporation
MacArthur Sylvia R.
Martine & Penilla & Gencarella LLP
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