Method and apparatus of a variable height and controlled...

Details Method and apparatus of a variable height and controlled... Method and apparatus of a variable height and controlled...

2006-01-24

2006-01-24

Nguyen, George (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With feeding of tool or work holder

C451S296000, C451S300000, C451S303000, C451S306000, C451S398000

Reexamination Certificate

active

06988934

ABSTRACT:
An apparatus for use in a chemical mechanical planarization (CMP) system is provided. The apparatus includes a platen capable of introducing fluid beneath a polishing pad and a platen support cover configured to surround the platen. The platen is disposed at a first level and the platen support cover is disposed at a second level, the first level being lower relative to the second level. Both the platen and the platen support cover are configured to be disposed below the polishing pad such that the polishing pad is closer to the second level than the first level. The platen support cover has a width at the second level that is substantially equal around the platen. An apparatus and method for controlling pressure beneath a polishing pad is also provided.

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