Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1996-04-19
1998-02-10
Nguyen, Nam
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
20429815, 20429806, 20429831, 20429832, 20429834, 118723E, 118728, C23C 1450, C23C 1600, C23F 102
Patent
active
057164860
ABSTRACT:
A device for reducing plasma irregularities includes an electrode assembly capable of applying an electric potential to said plasma. The electrode assembly includes a portion for reducing the plasma irregularities. The portion which reduces the plasma irregularities includes alternately a buried portion which is capable of altering the potential within the buried element, or else a conditioned portion of the surface which controls reflectivity and/or emissivity of portions of a surface of the electrode assembly differently.
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Patent Abstracts of Japan, vol. 015 No. 428 (E-1128), Oct. 30, 1991 & JP-A-03 179734 (Tokyo Electron LTD) Aug. 5, 1991.
Dalvie Manoj
Guarnieri C. Richard
McGill James J.
Rubolff Gary W.
Selwyn Gary S.
McDonald Rodney G.
Nguyen Nam
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