Method and apparatus for the compensation of edge ring wear...

Details Method and apparatus for the compensation of edge ring wear... Method and apparatus for the compensation of edge ring wear...

2005-05-24

2005-05-24

Niebling, John F. (Department: 2812)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With workpiece support

C118S728000

Reexamination Certificate

active

06896765

ABSTRACT:
A method for processing a plurality of substrates in a plasma processing chamber of a plasma processing system, each of the substrate being disposed on a chuck and surrounded by an edge ring during the processing. The method includes processing a first substrate of the plurality of substrates in accordance to a given process recipe in the plasma processing chamber. The method further includes adjusting, thereafter, a capacitance value of a capacitance along a capacitive path between a plasma sheath in the plasma processing chamber and the chuck through the edge ring by a given value. The method additionally includes processing a second substrate of the plurality of substrates in accordance to the given process recipe in the plasma processing chamber after the adjusting, wherein the adjusting is performed without requiring a change in the edge ring.

REFERENCES:
patent: 5252827 (1993-10-01), Koga et al.
patent: 6074488 (2000-06-01), Roderick et al.
patent: 6475336 (2002-11-01), Hubacek

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