Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-08-15
2006-08-15
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257SE21332
Reexamination Certificate
active
07091125
ABSTRACT:
A method for structuring an electrode, such as, for example, a cathode and/or an anode, for an organic light-emitting display by ablating the electrodes using a laser beam. An apparatus using the method for structuring an electrode is also provided. The laser beam is expanded to cover at least one target portion of each electrode to be ablated. A method for repairing an organic light-emitting display using the method and apparatus is also provided.
REFERENCES:
patent: 5514618 (1996-05-01), Hunter et al.
patent: 6146715 (2000-11-01), Kim et al.
patent: 6376799 (2002-04-01), Amako et al.
patent: 6576867 (2003-06-01), Lu et al.
patent: 6719916 (2004-04-01), Dubowski et al.
patent: 08222371 (1996-08-01), None
“Microfabrication of an electroluminescent polymer light emitting diode pixel array,” Salman Noach, Erez Z. Faraggi, Gil Cohen, Yair Avny, Ronny Neumann, Dan Davidov, and Aaron Lewis, Appl. Phys. Lett. 69 (24) Dec. 9, 1996, 0003-6951/96/69(24)/3650/3/$10.00, © 1996 American Institute of Physics.
Thomas Schrader
Werner Humbs
Dolan Jennifer M
H.C. Park & Associates PLC
Jr. Carl Whitehead
Samsung SDI & Co., Ltd.
LandOfFree
Method and apparatus for structuring electrodes for organic... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for structuring electrodes for organic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for structuring electrodes for organic... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3627487