4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including adhesive bonding step

Teruyuki Watahiki

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Method and apparatus for sticking a film to a lead frame

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent

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Method of applying adhesive to lead of lead frame and method of

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent

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Profile ID: LFUS-PAI-P-333951

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