Method and apparatus for semiconductor wafer cleaning using...

Details Method and apparatus for semiconductor wafer cleaning using... Method and apparatus for semiconductor wafer cleaning using...

2007-02-02

2009-10-20

Markoff, Alexander (Department: 1792)

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

C134S002000

Reexamination Certificate

active

07604011

ABSTRACT:
An apparatus and a method is provided for using high-frequency acoustic energy with a supercritical fluid to perform a semiconductor wafer (“wafer”) cleaning process. High-frequency acoustic energy is applied to the supercritical fluid to impart energy to particulate contamination present on the wafer surface. Energy imparted to particulate contamination via the high-frequency acoustic energy and supercritical fluid is used to dislodge and remove the particulate contamination from the wafer. Additionally, the wafer cleaning process benefits from the supercritical fluid properties of near zero surface tension, high diffusivity, high density, and chemical mixing capability.

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patent: 6602349 (2003-08-01), Chandra et al.
patent: 6875284 (2005-04-01), Scranton

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