Method and apparatus for securely dechucking wafers

Details Method and apparatus for securely dechucking wafers Method and apparatus for securely dechucking wafers

2011-08-09

2011-08-09

Patel, Dharti H (Department: 2836)

Electricity: electrical systems and devices

Electric charge generating or conducting means

Use of forces of electric charge or field

Reexamination Certificate

active

07995323

ABSTRACT:
A wafer stage installed in a process chamber for safely dechucking a wafer is provided. In one embodiment, the wafer stage comprises: a chuck support for supporting a chuck; a chuck mounted on the chuck support for receiving and attaching a wafer thereto; a support lift means for supporting the wafer; a driving means coupled to the support lift means for gradually raising the support lift means to contact the wafer in response to a variable quantity; a controller for receiving the variable quantity; and a regulating means coupled to the driving means and to the controller, the regulating means for controlling the variable quantity going to the driving means when a predetermined variable quantity is detected.

REFERENCES:
patent: 5491603 (1996-02-01), Birang et al.
patent: 5790365 (1998-08-01), Shel
patent: 6797639 (2004-09-01), Carducci et al.
patent: 7156951 (2007-01-01), Gao et al.
patent: 7292428 (2007-11-01), Hanawa et al.
patent: 2004/0223286 (2004-11-01), Chu et al.

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