Method and apparatus for removing a substrate from a polishing p

Details Method and apparatus for removing a substrate from a polishing p Method and apparatus for removing a substrate from a polishing p

1996-10-31

1999-05-04

Dentz, Bernard

Abrading

Machine

Rotary tool

156345, 216 89, 438692, B24B 100, B24B 2900

Patent

active

058998012

ABSTRACT:
A chemical mechanical polishing apparatus has a platen with a cavity with an opening to the top surface of the platen. A polishing pad is located at an upper surface of the platen. A flexible membrane is positioned in the cavity to define a first and a second volume. A pressure source is connected to the second volume to flex the membrane, and a lifting member is positioned in the first volume so that flexing of the membrane extends the lifting member through the opening to lift the substrate off the polishing pad. Alternately, de-ionized water may be forced through a passage in the platen and an aperture in the polishing pad to lift the substrate.

REFERENCES:
patent: 3913271 (1975-10-01), Boettcher
patent: 5245790 (1993-09-01), Jerbic
patent: 5246525 (1993-09-01), Sato
patent: 5423716 (1995-06-01), Strasbaugh
patent: 5498199 (1996-03-01), Karlsrud et al.
patent: 5527209 (1996-06-01), Volodarsky et al.

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