Method and apparatus for purging the back side of a substrate du

Details Method and apparatus for purging the back side of a substrate du Method and apparatus for purging the back side of a substrate du

1996-07-24

1999-03-23

Capossela, Ronald

Drying and gas or vapor contact with solids

Apparatus

With apparatus using centrifugal force

34314, 34317, F26B 1118

Patent

active

058844120

ABSTRACT:
A method of processing a disk-shaped substrate, or wafer, during a chemical vapor process includes a backside purge of the substrate with a purge gas. The backside purge is obtained by spinning the substrate about a central axis, directing a flow of the purge gas over the backside of the spinning substrate, and causing the purge gas to flow in an outward radial direction with the spinning substrate. An apparatus in a vapor processing system structured for conducting the backside purge includes a support mechanism structured and arranged to support the substrate and spin the substrate about a central axis, and a conduit coupled to a source of purge gas, structured and arranged to direct a flow of the purge gas over a backside of the substrate while the substrate is spinning such that the spinning substrate causes the purge gas to flow radially outward.

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patent: 5230741 (1993-07-01), van de Ven et al.
patent: 5238499 (1993-08-01), van de Ven et al.

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