Method and apparatus for producing uniform processing rates

Communications: radio wave antennas – Antennas – Having electric space discharge device

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C343S742000, C343S867000, C118S7230IR

Reexamination Certificate

active

06842147

ABSTRACT:
An antenna arrangement for generating an rf field distribution at a plasma generating region inside a chamber wall of a process chamber of a plasma processing apparatus is described. The antenna arrangement includes an rf inductive antenna to which an rf power supply can be connected to supply an rf current to generate a first rf field extending into the plasma generating region. A passive antenna is also provided which is inductively coupled to the rf inductive antenna and configured to generate a second rf field modifying the first rf field. The rf field distribution at the plasma generating region increases the processing uniformity of the processing apparatus compared to that in the absence of the passive antenna.

REFERENCES:
patent: 5401350 (1995-03-01), Patrick et al.
patent: 5578165 (1996-11-01), Patrick et al.
patent: 5731565 (1998-03-01), Gates
patent: 5759280 (1998-06-01), Holland et al.
patent: 5897712 (1999-04-01), Hanawa et al.
patent: 6016131 (2000-01-01), Sato et al.
patent: 6310577 (2001-10-01), Ra
patent: 6320320 (2001-11-01), Bailey, III et al.
patent: 6341574 (2002-01-01), Bailey et al.
patent: 6414648 (2002-07-01), Holland et al.
patent: 6508198 (2003-01-01), Hoffman et al.
patent: 6653791 (2003-11-01), Bailey, III et al.
patent: 0820086 (1998-01-01), None
International Search Report, dated Nov. 6, 2003.
Ansoft Corporation,Maxwell® 3D, Product Overview, http://www.ansoft.com/products/em/max3d/overview.cfm Jan. 17, 2003.
U.S. Appl. No. 10/033,807, filed Dec. 18, 2001.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for producing uniform processing rates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for producing uniform processing rates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for producing uniform processing rates will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3367060

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.