Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
2000-02-07
2000-12-19
Nguyen, Nam
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20419212, 20429803, 20429808, 20429811, C23C 1434
Patent
active
061623326
ABSTRACT:
A method and an apparatus for preventing arcing in a sputter chamber by utilizing a first ground detection circuit, a second ground detection circuit and an interlock circuit are disclosed. The first ground detection circuit is utilized to detect the existence of a grounding condition between a clamp ring and a chamber shield positioned in a sputter chamber after reactant gases are flown into the chamber. The first ground detection circuit is capable of outputting a first signal to an interlock circuit when a grounding condition is detected to interrupt a power supply to the sputter chamber. The second ground detection circuit is utilized for detecting the existence of a grounding condition between a clamp ring and a chamber shield after a plasma for deposition is ignited in the sputter chamber. The second ground detection circuit is also capable of outputting a second signal to an interlock circuit when a grounding condition is detected to interrupt a power supply to the sputter chamber. The apparatus further includes an interlock circuit for receiving a first signal or a second signal and then outputting a third signal to interrupt a power supply to a sputter chamber before the occurrence of an arcing condition.
REFERENCES:
patent: 5108570 (1992-04-01), Wang
patent: 5116482 (1992-05-01), Setoyama et al.
patent: 5241152 (1993-08-01), Anderson et al.
patent: 5281321 (1994-01-01), Sturmer et al.
patent: 5294320 (1994-03-01), Somekh et al.
patent: 5303139 (1994-04-01), Mark
patent: 5427669 (1995-06-01), Drummond
patent: 5431799 (1995-07-01), Mosley et al.
patent: 5611899 (1997-03-01), Maass
patent: 5660700 (1997-08-01), Shimizu et al.
patent: 5682067 (1997-10-01), Manley et al.
patent: 5698082 (1997-12-01), Teschner et al.
patent: 5772858 (1998-06-01), Tepman
patent: 5882492 (1999-03-01), Manley et al.
Cantelmo Gregg
Nguyen Nam
Taiwan Semiconductor Manufacturing Company , Ltd.
LandOfFree
Method and apparatus for preventing arcing in sputter chamber does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for preventing arcing in sputter chamber, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for preventing arcing in sputter chamber will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-268254