Method and apparatus for pressure control in vacuum processors

Fluid handling – Processes – Involving pressure control

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

1374875, 137114, F16K 1734, F17D 116

Patent

active

061421634

ABSTRACT:
A method and apparatus is disclosed for controlling the pressure of a reaction chamber in wafer processing equipment. The disclosed apparatus and method uses a ballast port for inserting gas into the evacuation system, thereby controlling the pressure in the reaction chamber. The disclosed apparatus and method further uses estimation curves to estimate the desired position of a controlled gate valve which is located between the reaction chamber and turbo pump. The disclosed apparatus and method achieves a set point pressure by prepositioning a throttle valve followed by repositioning the throttle valve based on the difference between a measure pressure and the set point pressure using proportional and integral control, wherein enablement of integral control is delay for a pre-specified period.

REFERENCES:
patent: 4253480 (1981-03-01), Kessel et al.
patent: 4394871 (1983-07-01), Czajka et al.
patent: 4539967 (1985-09-01), Nakajima et al.
patent: 4702273 (1987-10-01), Allen, Jr. et al.
patent: 4720807 (1988-01-01), Farran et al.
patent: 4798521 (1989-01-01), Schmidt et al.
patent: 4911103 (1990-03-01), Davis et al.
patent: 4949670 (1990-08-01), Krogh
patent: 4961441 (1990-10-01), Salter
patent: 5020176 (1991-06-01), Dotson
patent: 5020564 (1991-06-01), Thoman et al.
patent: 5031674 (1991-07-01), Mack
patent: 5220940 (1993-06-01), Palmer
patent: 5292370 (1994-03-01), Tsai et al.
patent: 5365772 (1994-11-01), Ueda et al.
patent: 5534069 (1996-07-01), Kuwabara et al.
patent: 5725672 (1998-03-01), Schmitt et al.
patent: 6063198 (2000-05-01), Bang et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for pressure control in vacuum processors does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for pressure control in vacuum processors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for pressure control in vacuum processors will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1631654

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.