Etching a substrate: processes – Gas phase etching of substrate – Application of energy to the gaseous etchant or to the...
Reexamination Certificate
2005-12-27
2005-12-27
Ahmed, Shamim (Department: 1765)
Etching a substrate: processes
Gas phase etching of substrate
Application of energy to the gaseous etchant or to the...
C216S041000, C216S059000, C430S005000, C430S030000, C438S725000
Reexamination Certificate
active
06979408
ABSTRACT:
The invention provides methods and apparatuses for controlling critical dimension (CD) uniformity of a photomask by neutralizing CD variation associated with pattern density and process fluctuation.
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Takahashi, et al., “Performance of JBX-9000MV with negative tone resist for 130 nm reticle”,Proceedings of SPIE, 20thAnnual BACUS Symposium on Photomask Technology, vol. 4186, pp. 22-33, Sep. 13-15, 2000.
Gujisawa, et al., Evaluation of loading effect of NLD dry etching (2),Proceedings of SPIE, 20thAnnual BACUS Symposium on Photomask Technology, vol. 4186, pp. 549-552, Sep. 13-15, 2000.
Abe Tsukasa
Tezuka Yoshihiro
Yokoyama Toshifumi
Ahmed Shamim
Dai Nippon Printing Co. Ltd.
Intel Corporation
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