Fishing – trapping – and vermin destroying
Patent
1993-07-23
1995-03-21
Hearn, Brian E.
Fishing, trapping, and vermin destroying
437226, 437237, H01L 2166
Patent
active
053995058
ABSTRACT:
A semiconductor wafer (20) having integrated circuit dice (22), wafer conductors (42-47, 50-53), and wafer contact pads (38) formed thereon. The wafer conductors (42-47, 50-53) are used to transfer electrical signals to and from the integrated circuit dice (22) on semiconductor wafer (20) so that wafer level testing and burn-in can be performed on the integrated circuit dice (22). In accordance with one embodiment of the present, each wafer conductor (45, 52) is electrically coupled to the same bonding pad (78) on each integrated circuit dice (22). Each wafer conductor (42-47, 50-53) includes at least a portion of conductor (42-47) which overlies the upper surface of at least one integrated circuit dice (22).
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Intel Corporation, Intel486.TM. DX Microprocessor Data Book, Jun. 1991, pp. 127-141, Order No.: 240440-004.
Ballouli Walid S.
Bollish Robert W.
Burton Marcus R.
Carlquist James H.
Cheng Shih K.
Hearn Brian E.
Hill Susan C.
Motorola Inc.
Picardat Kevin M.
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