Method and apparatus for oxidizing nitrides

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – By reaction with substrate

Reexamination Certificate

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C438S792000, C438S798000, C438S769000, C438S770000, C438S772000

Reexamination Certificate

active

07037861

ABSTRACT:
A method for oxidizing a nitride film is disclosed, which includes the steps of: providing a nitride film formed on an electrically conductive substrate; irradiating the nitride film with a light beam and getting close to the nitride film with a electrically conductive probe; and exerting a bias between the electrically conductive substrate and the electrically conductive probe. The method can oxidize the nitrides quickly and reduce the cost building a nano-structure in the nitride film. An apparatus for oxidizing a nitride film is also disclosed herewith.

REFERENCES:
patent: 6190508 (2001-02-01), Peng et al.
patent: 6274513 (2001-08-01), Gwo et al.
T. Enomoto et. al.;Thermal oxidation rate of a Si/sub 3/N/sub 4/ film and its masking effect against oxidation of silicon; Japanese Journal of Applied Physics, Jun. 1978, vol. 17, No. 6.
S. D. Wolter et. al.;X-ray photoelectron spectroscopy and x-ray diffraction study of the thermal oxide on gallium nitride; American Institute of Physics, Appl. Phys. Lett. 70 (16), Apr. 21, 1997, pp. 2156-2158.
C. B. Vartuli et. al.;High temperature surface degradation of III-V nitrides; American Vacuum Society, J. Vac. Sci. Technol. 8 14(6), Nov./Dec. 1996, pp. 3523-3531.
Terrance B. Tripp;The Anodic Oxidation of Silicon Nitride Films on Silicon; J. Electrochen. Soc., vol. 117, No. 2, Feb. 1970, pp. 157-159.
F. S.-S. Chien et. al.;Nanometer-scale conversion of Si3N4to SiOx; American Institute of Physics, Applied physics Letter, vol. 76, No. 3, Jan. 17, 2000, pp. 360-362.

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