Method and apparatus for optical emission end point detection in

Details Method and apparatus for optical emission end point detection in Method and apparatus for optical emission end point detection in

1992-12-23

1994-05-03

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156627, 156345, 20419233, 20429832, G01N 2100

Patent

active

053084144

ABSTRACT:
An apparatus and method for determining the time at which a plasma etching process should be terminated. The process generates at least one etch product species and a continuum plasma emission. The apparatus monitors the optical emission intensity of the plasma in a narrow band centered about a predetermined spectral line and generates a first signal indicative of the spectral intensity of the etch product species. The apparatus further monitors the optical emission intensity of the plasma in a wide band and generates a second signal indicative of the spectral intensity of the continuum plasma emission. The apparatus further monitors the magnitudes of the first and second signals and generates a termination signal when the magnitudes diverge.

REFERENCES:
patent: 4289188 (1981-09-01), Mizutani et al.
patent: 4430151 (1984-02-01), Tsukada
patent: 4491499 (1984-03-01), Jerde et al.
patent: 4657620 (1987-04-01), Davis et al.
patent: 5045149 (1991-09-01), Nulty
patent: 5160402 (1992-11-01), Cheng
Khoury, "Real-Time Etch plasma monitor system", IBM Technical Disclosure Bulletin, vol. 25 No. 11A Apr. 1983.

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