Method and apparatus for monitoring the thickness of a...

Details Method and apparatus for monitoring the thickness of a... Method and apparatus for monitoring the thickness of a...

2005-08-10

2008-08-05

Verbitsky, Gail (Department: 2855)

Thermal measuring and testing

Distance or angle

Thickness, erosion, or deposition

C374S001000

Reexamination Certificate

active

07407324

ABSTRACT:
A method and apparatus for determining thickness of a metallic layer being deposited on a collector. The method includes applying an electromagnetic field to a conductive layer on the collector. Then the temperature or the change in temperature of the collector is determined. The metal thickness is determined as a function of the temperature or change in temperature. The apparatus includes a collector, a thermocouple associated with the collector, and a source of an electromagnetic field.

REFERENCES:
patent: 4513384 (1985-04-01), Rosencwaig
patent: 4679946 (1987-07-01), Rosencwaig et al.
patent: 5166080 (1992-11-01), Schietinger et al.
patent: 5258824 (1993-11-01), Carlson et al.
patent: 5893050 (1999-04-01), Park et al.
patent: 6178390 (2001-01-01), Jun
patent: 6283630 (2001-09-01), Yazawa
patent: 6534975 (2003-03-01), Beeck et al.
patent: 6646752 (2003-11-01), Chen et al.
patent: 6666577 (2003-12-01), Shibata et al.
patent: 7204639 (2007-04-01), Gotkis et al.
patent: 2002/0031164 (2002-03-01), Scheidt et al.

Affiliated with

Also associated with

Rating

Method and apparatus for monitoring the thickness of a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for monitoring the thickness of a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for monitoring the thickness of a... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3995536