Method and apparatus for monitoring plasma processing operations

Details Method and apparatus for monitoring plasma processing operations Method and apparatus for monitoring plasma processing operations

1998-04-23

2000-07-18

Jenkins, Daniel J.

Etching a substrate: processes

Gas phase etching of substrate

With measuring, testing, or inspecting

C23F 100

Patent

active

060903023

ABSTRACT:
The invention generally relates to various aspects of a plasma process, and more specifically the monitoring of such plasma processes. One aspect relates in at least some manner to calibrating or initializing a plasma monitoring assembly. This type of calibration may be used to address wavelength shifts, intensity shifts, or both associated with optical emissions data obtained on a plasma process. A calibration light may be directed at a window through which optical emissions data is being obtained to determine the effect, if any, that the inner surface of the window is having on the optical emissions data being obtained therethrough, the operation of the optical emissions data gathering device, or both. Another aspect relates in at least some manner to various types of evaluations which may be undertaken of a plasma process which was run, and more typically one which is currently being run, within the processing chamber. Plasma health evaluations and process identification through optical emissions analysis are included in this aspect. Yet another aspect associated with the present invention relates in at least some manner to the endpoint of a plasma process (e.g., plasma recipe, plasma clean, conditioning wafer operation) or discrete/discernible portion thereof (e.g., a plasma step of a multiple step plasma recipe). A final aspect associated with the present invention relates to how one or more of the above-noted aspects may be implemented into a semiconductor fabrication facility, such as the distribution of wafers to a wafer production system.

REFERENCES:
patent: Re32156 (1986-05-01), Tokuda et al.
patent: 3985712 (1976-10-01), Garst
patent: 4278060 (1981-07-01), Isobe et al.
patent: 4289188 (1981-09-01), Mizutani et al.
patent: 4355615 (1982-10-01), Asano et al.
patent: 4415402 (1983-11-01), Gelernt et al.
patent: 4491499 (1985-01-01), Jerde et al.
patent: 4493745 (1985-01-01), Chen et al.
patent: 4504920 (1985-03-01), Mickowski
patent: 4507605 (1985-03-01), Geisel
patent: 4541718 (1985-09-01), Osada et al.
patent: 4609426 (1986-09-01), Ogawa et al.
patent: 4609810 (1986-09-01), O'Brien et al.
patent: 4611919 (1986-09-01), Brooks, Jr. et al.
patent: 4615761 (1986-10-01), Tada et al.
patent: 4675072 (1987-06-01), Bennett et al.
patent: 4721083 (1988-01-01), Hosaka
patent: 4771230 (1988-09-01), Zeh
patent: 4846928 (1989-07-01), Dolins et al.
patent: 4847792 (1989-07-01), Barna et al.
patent: 4847817 (1989-07-01), Au et al.
patent: 5014217 (1991-05-01), Savage
patent: 5047612 (1991-09-01), Savkar et al.
patent: 5118378 (1992-06-01), Moroi et al.
patent: 5160402 (1992-11-01), Cheng
patent: 5168699 (1992-12-01), McCarty et al.
patent: 5169407 (1992-12-01), Mase et al.
patent: 5200023 (1993-04-01), Gifford et al.
patent: 5210704 (1993-05-01), Husseiny
patent: 5223683 (1993-06-01), Ishizaka
patent: 5280983 (1994-01-01), Maydan et al.
patent: 5283418 (1994-02-01), Bellows et al.
patent: 5308414 (1994-05-01), O'Neill et al.
patent: 5326975 (1994-07-01), Barna
patent: 5343412 (1994-08-01), Birang
patent: 5347460 (1994-09-01), Gifford et al.
patent: 5405488 (1995-04-01), Dimitrelis et al.
patent: 5424633 (1995-06-01), Soiferman
patent: 5428444 (1995-06-01), Haddock et al.
patent: 5450205 (1995-09-01), Sawin et al.
patent: 5455061 (1995-10-01), Matossian et al.
patent: 5467013 (1995-11-01), Williams et al.
patent: 5467883 (1995-11-01), Frye et al.
patent: 5471401 (1995-11-01), Nicholson et al.
patent: 5500076 (1996-03-01), Jerbic
patent: 5526293 (1996-06-01), Mozumder et al.
patent: 5546322 (1996-08-01), Gifford et al.
patent: 5551982 (1996-09-01), Anderson et al.
patent: 5552016 (1996-09-01), Ghanayem
patent: 5602757 (1997-02-01), Haseley et al.
patent: 5614055 (1997-03-01), Faribairn et al.
patent: 5641375 (1997-06-01), Nitescu et al.
patent: 5647913 (1997-07-01), Blalock
patent: 5647953 (1997-07-01), Williams et al.
patent: 5654796 (1997-08-01), Mundt
patent: 5656902 (1997-08-01), Lowrance
patent: 5658423 (1997-08-01), Angell et al.
patent: 5711843 (1998-01-01), Jahns
patent: 5728253 (1998-03-01), Saito et al.
"Real-Time Etch Plasma Monitor System", IBM Technical Disclosure Bulletin, vol. 25, No. 11A, pp. 5721-5723, H.A. Khoury (Apr. 1983).
"A Plasma Process Monitor/Control System", Surface and Interface Analysis, vol. 24, pp. 124-133, Joel O. Stevenson, Pamela P. Ward, Michael L. Smith, and Richard J. Markle (Feb. 1998).
"Process Uniformity for Plasma Etchback and Desmear in Printed Wiring Board Manufacturing", Sandia Report, SAND96-1954; UC-706, pp. 1-5, Pamela P. Ward, Michael L. Smith, Joel O. Stevenson, Rick Smedley (Aug. 1996).
"Sandia Computer Program Saves Money for Microchip and Circuit Board Makers", Handout at Ceremony at Sandia National Laboratories, pp. 1-3 (Oct. 1997).
U.S. application No. 09/065,203, Smith, Jr. et al., filed Apr. 23, 1998.
U.S. application No. 09/064,966, Smith, Jr. et al., filed Apr. 23, 1998.
U.S. application No. 09/065,245, Smith, Jr. et al., filed Apr. 23, 1998.
U.S. application No. 09/065,006, Smith, Jr. et al., filed Apr. 23, 1998.
U.S. application No. 09/065,359, Smith, Jr. et al., filed Apr. 23, 1998.
U.S. application No. 09/064,793, Smith, Jr. et al., filed Apr. 23, 1998.
U.S. application No. 09/064,957, Smith, Jr. et al., filed Apr. 23, 1998.
U.S. application No. 09/065,680, Smith, Jr. et al., filed Apr. 23, 1998.
U.S. application No. 09/064,991, Smith, Jr. et al., filed Apr. 23, 1998.
U.S. application No. 09/065,257, Smith, Jr. et al., filed Apr. 23, 1998.
U.S. application No. 09/065,307, Smith, Jr. et al., filed Apr. 23, 1998.
U.S. application No. 09/065,274, Smith, Jr. et al., filed Apr. 23, 1998.
U.S. application No. 09/064,970, Smith, Jr. et al., filed Apr. 23, 1998.
U.S. application No. 09/065,247, Smith, Jr. et al., filed Apr. 23, 1998.
U.S. application No. 09/064,965, Smith, Jr. et al., filed Apr. 23, 1998.
U.S. application No. 09/065,195, Smith, Jr. et al., filed Apr. 23, 1998.
U.S. application No. 09/065,362, Smith, Jr. et al., filed Apr. 23, 1998.
U.S. application No. 09/064,972, Smith, Jr. et al., filed Apr. 23, 1998.
U.S. application No. 09/065,358, Smith, Jr. et al., filed Apr. 23, 1998.

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