Method and apparatus for low energy electron enhanced etching of

Etching a substrate: processes – Gas phase etching of substrate – Application of energy to the gaseous etchant or to the...

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216 66, 216 67, 216 68, H05H 100

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060276630

ABSTRACT:
A method-of low-damage, anisotropic etching of substrates including mounting the substrate upon the anode in a DC plasma reactor and subjecting the substrate to a plasma of low-energy electrons and a species reactive with the substrate. An apparatus for conducting low-damage, anisotropic etching including a DC plasma reactor, a permeable wall hollow cold cathode, an anode, and means for mounting the substrate upon the anode.

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