Method and apparatus for local polishing control

Details Method and apparatus for local polishing control Method and apparatus for local polishing control

2003-03-04

2010-11-30

King, Roy (Department: 1793)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S228100, C204S228900, C204S260000, C204S272000, C205S640000, C205S641000, C205S646000

Reexamination Certificate

active

07842169

ABSTRACT:
A method and apparatus for local polishing and deposition control in a process cell is generally provided. In one embodiment, an apparatus for electrochemically processing a substrate is provided that selectively polishes discrete conductive portions of a substrate by controlling an electrical bias profile across a processing area, thereby controlling processing rates between two or more conductive portions of the substrate.

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