Method and apparatus for inspection of solder joints by x-ray fl

Details Method and apparatus for inspection of solder joints by x-ray fl Method and apparatus for inspection of solder joints by x-ray fl

1994-03-07

1996-02-20

Church, Craig E.

X-ray or gamma ray systems or devices

Specific application

Lithography

378 982, G01N 2302

Patent

active

054935946

ABSTRACT:
A method and apparatus for inspecting a solder joint by an X-ray fluoroscopic image in which an X-ray is irradiated on an object to be inspected located by a specimen stage and having a lead of an electronic part soldered to a substrate to detect an X-ray fluoroscopic image signal, a position of a lead in a tip direction is obtained by a distribution of projection with said X-ray fluoroscopic image signal projected in a lead row direction, a position of a lead in a row direction is obtained by a distribution of projection with said X-ray fluoroscopic image projected in a lead tip direction to extract a position of a solder joint as an object to be inspected, and said X-ray fluoroscopic image is evaluated every solder joint in accordance with the postion information to effect a defect detection.

REFERENCES:
patent: 4772125 (1988-09-01), Toshimura et al.
patent: 4809308 (1989-02-01), Adams et al.
patent: 4910757 (1990-03-01), Kiyasu et al.
Howard Bierman, "Packing Changes Make Automatic Testing Tougher, More Costly", from Electronics Special Report, Jul. 15, 1985, pp. 48-52.
Ronald Pound, "Image Processing Boosts the Power of Non-destructive Testing", from Electronic Packaging & Production, Jun. 1985, pp. 98-104.
Nakagawa Y., "Automatic Visual Inspection of Solder Joints on Printed Circuit Boards", SPIE Proceedings, vol. 336, Robot Vision (1982) pp. 121-127.

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