Method and apparatus for in-situ film stack processing

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Reexamination Certificate

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C438S710000, C216S058000, C216S041000, C216S067000, C216S074000, C216S075000, C216S079000, C156S345350, C156S345310

Reexamination Certificate

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10821723

ABSTRACT:
Embodiments of a cluster tool, processing chamber and method for processing a film stack are provided. In one embodiment, a method for in-situ etching of silicon and metal layers of a film stack is provided that includes the steps of etching an upper metal layer of the film stack in a processing chamber to expose a portion of an underlying silicon layer, and etching a trench in the silicon layer without removing the substrate from the processing chamber. The invention is particularly useful for thin film transistor fabrication for flat panel displays.

REFERENCES:
patent: 2344138 (1944-03-01), Drummond
patent: 3109100 (1963-10-01), Gecewicz
patent: 3291715 (1966-12-01), Anderson
patent: 4431898 (1984-02-01), Reinberg et al.
patent: 4778561 (1988-10-01), Ghanbari
patent: 4867859 (1989-09-01), Harada et al.
patent: 4871431 (1989-10-01), Ogle et al.
patent: 4948458 (1990-08-01), Ogle
patent: 5045166 (1991-09-01), Bobblo
patent: 5061838 (1991-10-01), Lane et al.
patent: 5105761 (1992-04-01), Charlet et al.
patent: 5106827 (1992-04-01), Borden et al.
patent: 5107201 (1992-04-01), Ogle
patent: 5277751 (1994-01-01), Ogle
patent: 5290382 (1994-03-01), Zarowin et al.
patent: 5435881 (1995-07-01), Ogle
patent: 5478766 (1995-12-01), Park et al.
patent: 5505780 (1996-04-01), Dalvie et al.
patent: 5520209 (1996-05-01), Goins et al.
patent: 5542559 (1996-08-01), Kawakami et al.
patent: 5569363 (1996-10-01), Bayer et al.
patent: 5682517 (1997-10-01), Shan
patent: 5770982 (1998-06-01), Moore
patent: 5788778 (1998-08-01), Shang et al.
patent: 5892328 (1999-04-01), Shang et al.
patent: 5895548 (1999-04-01), Ettinger et al.
patent: 5897752 (1999-04-01), Hong et al.
patent: 5935077 (1999-08-01), Ogle
patent: 5948168 (1999-09-01), Shan et al.
patent: 5994236 (1999-11-01), Ogle
patent: 5994942 (1999-11-01), Itoh
patent: 5998933 (1999-12-01), Shun'ko
patent: 6024044 (2000-02-01), Law et al.
patent: 6041735 (2000-03-01), Murzin et al.
patent: 6055927 (2000-05-01), Shang et al.
patent: 6132552 (2000-10-01), Donohoe et al.
patent: 6150628 (2000-11-01), Smith et al.
patent: 6172322 (2001-01-01), Shang et al.
patent: 6203657 (2001-03-01), Collison et al.
patent: 6239553 (2001-05-01), Barnes et al.
patent: 6260894 (2001-07-01), Minnick et al.
patent: 6283692 (2001-09-01), Perlov et al.
patent: 6418874 (2002-07-01), Cox et al.
patent: 6432255 (2002-08-01), Sun et al.
patent: 6440753 (2002-08-01), Ning et al.
patent: 6440864 (2002-08-01), Kropewnicki et al.
patent: 6468601 (2002-10-01), Shang et al.
patent: 2001/0006070 (2001-07-01), Shang et al.
patent: 2002/0007795 (2002-01-01), Bailey, III. et al.
patent: 2002/0132488 (2002-09-01), Nallan
patent: 2002/0179248 (2002-12-01), Kabansky
patent: 2002/0192957 (2002-12-01), Chien et al.
patent: 0 424 256 (1991-04-01), None
patent: 0 546 852 (1993-06-01), None
patent: 0 823 218 (1998-04-01), None
patent: WO 99/00823 (1999-01-01), None
patent: WO 01/11650 (2001-02-01), None
patent: WO 03/012567 (2003-02-01), None
Wolf et al (vol. 1, Process Technology, 1986, Lattice Press, figure 5, pp. 546-547 & p. 432)).
Van Zant (A Practicle Guide to Semiconductor Processing; Semiconductor Services; 1986; section 13.6, figure 13.6).
Leverd et al. (Wsi/Poly-Si gate Stack etching for advanced dRAM applications (1999 IEEE/SEMI Advanced Semiconductor manufacturing Conference and Workshop; Sep. 8-10, 1999; Boston, MA, USA).
Wolf et al (Silicon Processing for the VLSI Era; vol. 1; 1986; Lattice Press).
Zhang et al., “A High Power Radio Frequency Transformer for Plasma Production in a Toroidal Plasma Source,”Rev. Sci. Instrum., 69(1), Jan. 1998, 101-108.
Partial International Search Report dated Apr. 26, 2006 for PCT/US2005/011319.
PCT International Search Report for PCT/US2005/011319, date of mailing, Jul. 13, 2006.

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