Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Patent
1996-02-09
2000-09-19
Crane, Sara
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
438792, 427569, H05H 124
Patent
active
06121163&
ABSTRACT:
A method and apparatus for depositing a layer having improved film quality at an interface. The method includes the steps of introducing an inert gas into a processing chamber and forming a plasma from the inert gas by applying RF power to the chamber at a selected rate of increase. After RF power has reached full power, a process gas including a reactant gas is introduced to deposit the layer. In a preferred embodiment, the reactant gas is tetraethoxysilane. In another preferred embodiment, the process gas further includes fluorine.
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Bhan Mohan K.
Gupta Anand
Rana Virendra V. S.
Subrahmanyam Sudhakar
Verma Amrita
Applied Materials Inc.
Crane Sara
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