Coating processes – Direct application of electrical – magnetic – wave – or... – Plasma
Patent
1995-12-22
1999-04-27
Dang, Thi
Coating processes
Direct application of electrical, magnetic, wave, or...
Plasma
438788, 118723E, C23C 1600, H01L 2100
Patent
active
058977112
ABSTRACT:
A method and an apparatus for depositing a dielectric film on a substrate in a plasma process chamber wherein the uniformity of the refractive index of the film is improved. The method involves introducing an oxygen reactant and a silicon reactant into the process chamber and generating a plasma, contacting the substrate with the plasma and depositing a SiO.sub.x film thereon. To control uniformity of the refractive index of the film, a second oxygen reactant is injected locally at a position at which it is desired to lower the refractive index. The second oxygen reactant can be O.sub.2 which is injected at the periphery of the substrate. The gas injection apparatus includes a substrate support below the substrate and a deposition shield surrounding the substrate. The shield contains gas injection outlets directed toward the periphery of the substrate for supplying the O.sub.2 to a region above the outer periphery of the substrate.
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Dang Thi
Lam Research Corporation
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