Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-10-25
2005-10-25
Brewster, William M. (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S642000, C438S649000, C438S654000
Reexamination Certificate
active
06958290
ABSTRACT:
In an integrated device, a via is formed in a substrate layer and a barrier layer is formed on the substrate layer in the via. A seed layer is formed on the barrier layer in the via. The seed layer includes a first material and a second material. The first material provides an ability for the second material to maintain an adherence to the barrier layer.
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Faust, Jr. Richard A.
Jiang Qing-Tang
Lu Jiong-Ping
Brewster William M.
McLarty Peter K.
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