Optics: measuring and testing – Shape or surface configuration
Reexamination Certificate
2005-12-27
2005-12-27
Mai, Huy (Department: 2873)
Optics: measuring and testing
Shape or surface configuration
C356S612000, C356S446000
Reexamination Certificate
active
06980300
ABSTRACT:
A method for polishing wafers includes polishing a process layer formed on a wafer, the process layer overlying a grating structure; illuminating at least a portion of the process layer and the grating structure; measuring light reflected from the illuminated portion of the process layer and the grating structure to generate a reflection profile; comparing the measured reflection profile to a target reflection profile having an acceptable degree of planarity; and terminating the polishing of the process layer based on the comparison of the measured reflection profile and the target reflection profile. A metrology tool adapted to measure a wafer having a grating structure and a process layer formed over the grating structure after initiation of a polishing process includes a light source, a detector, and a data processing unit. The light source is adapted to illuminate at least a portion of the process layer overlying the grating structure. The detector is adapted to measure light reflected from the illuminated portion of the process layer and the grating structure to generate a reflection profile. The data processing unit is adapted to compare the measured reflection profile to a target reflection profile having an acceptable degree of planarity and generate an endpoint signal based on the comparison of the measured reflection profile and the target reflection profile.
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Lensing Kevin R.
Stirton James Broc
Advanced Micro Devices , Inc.
Mai Huy
Williams Morgan & Amerson
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