Method and apparatus for forming metal layers

Details Method and apparatus for forming metal layers Method and apparatus for forming metal layers

2005-03-08

2005-03-08

Wong, Edna (Department: 1753)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Utilizing brush or absorbent applicator

C205S102000, C205S103000, C205S123000, C205S157000

Reexamination Certificate

active

06863794

ABSTRACT:
A method of forming a metal layer on a substrate is disclosed. The metal layer is formed using a combined electrochemical plating/electrochemical mechanical polishing (ECP/EMP) process. In the ECP/EMP process, the metal layer is deposited on the substrate by contacting the substrate with a porous pad and then alternately applying a first electrical potential and a second electrical potential to an electrolyte plating solution. The first electrical potential functions to deposit metal on the substrate while the second electrical potential functions to remove metal from topographic portions thereof.

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Nogami;An Annovation to Integrate Porous Low-K Materials and Copper; InterConnect Japan 2001; Honeywell Seminar Dec. 6, 2001; pp. 1-12.

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