Method and apparatus for flip chip attachment by post...

Details Method and apparatus for flip chip attachment by post... Method and apparatus for flip chip attachment by post...

2008-05-06

2008-05-06

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Process

Plural joints

C228S200000, C228S233200

Reexamination Certificate

active

07367489

ABSTRACT:
A solder bump reflow process includes raising the temperature of an aligned die-substrate assembly to a temperature and for a time sufficient to cause a first reflow; allowing the temperature of the assembly to fall to a first cooling temperature and for a time sufficient to re-solidify the solder; raising the temperature of the die-substrate assembly a second time to a temperature and for a time sufficient to cause a second reflow; allowing the temperature of the assembly to fall a second time to a second cooling temperature and eventually to an ambient room temperature; in which at least the first and second melts and the first re-solidification are conducted without exposing the assembly to oxidizing atmosphere. Also, apparatus for carrying out the method includes a multi-zone oven.

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