Method and apparatus for etch endpoint detection

Details Method and apparatus for etch endpoint detection Method and apparatus for etch endpoint detection

2006-05-30

2006-05-30

Toatley, Jr., Gregory J (Department: 2877)

Optics: measuring and testing

With plural diverse test or art

C356S316000

Reexamination Certificate

active

07053994

ABSTRACT:
Broadly speaking, an invention is provided for monitoring a plasma optical emission. More specifically, the present invention provides a method for monitoring the plasma optical emission through a variable aperture to detect an endpoint of a plasma etching process without interferences that could lead to false endpoint calls. The method includes collecting optical emission data from a plasma through an aperture defined by moveable members. The moveable members are capable of varying a configuration of the aperture. The method also includes holding the moveable members at a particular time to cause the aperture to maintain a fixed configuration. The method further includes detecting a specific perturbation in the plasma optical emission while holding the moveable members.

REFERENCES:
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patent: 2002/0139925 (2002-10-01), Mitrovic
patent: 2004/0026035 (2004-02-01), Mitrovic
patent: 2004/0045933 (2004-03-01), Kaji et al.
patent: 2004/0104681 (2004-06-01), Mitrovic
patent: 2004/0179187 (2004-09-01), Mettes

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