Method and apparatus for electrochemical plating...

Details Method and apparatus for electrochemical plating... Method and apparatus for electrochemical plating...

2011-08-02

2011-08-02

Bell, Bruce F (Department: 1759)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Treating substrate prior to coating

C205S263000, C205S291000, C205S123000, C205S147000, C205S157000, C204S22400M, C204S199000, C204S212000, C204S218000, C204S242000

Reexamination Certificate

active

07988843

ABSTRACT:
A method of electroplating conductive material on semiconductor wafers controls undesirable surface defects by reducing the electroplating current as the wafer is being initially immersed in a plating bath. Further defect reduction and improved bottom up plating of vias is achieved by applying a static charge on the wafer before it is immersed in the bath, in order to enhance bath accelerators used to control the plating rate. The static charge is applied to the wafer using a supplemental electrode disposed outside the plating bath.

REFERENCES:
patent: 6495007 (2002-12-01), Wang
patent: 6793796 (2004-09-01), Reid et al.
patent: 2001/0005056 (2001-06-01), Cohen
patent: 2004/0149584 (2004-08-01), Nagai et al.
patent: 2004/0217009 (2004-11-01), Mikkola et al.

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