Semiconductor device manufacturing: process – Chemical etching – Having liquid and vapor etching steps
Reexamination Certificate
2006-05-02
2006-05-02
Dang, Phuc T. (Department: 2818)
Semiconductor device manufacturing: process
Chemical etching
Having liquid and vapor etching steps
C438S727000, C438S907000
Reexamination Certificate
active
07037842
ABSTRACT:
A method and apparatus for processing a wafer is described. According to the present invention a wafer is placed on a substrate support. A liquid is then fed through a conduit having an output opening over the wafer. A gas is dissolved in the liquid prior to the liquid reaching the output over the wafer by flowing a gas into the conduit through a venturi opening formed in the conduit. The liquid with dissolved gas is then fed through the opening and onto the wafer where it can be used to etch, clean, or rinse a wafer.
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Truman J. Kelly
Verhaverbeke Steven
Applied Materials Inc.
Blakely & Sokoloff, Taylor & Zafman
Dang Phuc T.
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