Method and apparatus for detecting wafer flaw

Details Method and apparatus for detecting wafer flaw Method and apparatus for detecting wafer flaw

2005-09-13

2005-09-13

Williams, Hezron (Department: 2856)

Measuring and testing

Vibration

By mechanical waves

C073S627000, C073S628000

Reexamination Certificate

active

06941811

ABSTRACT:
The present invention provides an apparatus for detecting flaws in a wafer. The apparatus has a detection platform for holding a wafer positioned thereon, a cross-bar ultrasonic detection device positioned above the detection platform for emitting and receiving an ultrasonic wave reflected by a wafer; and a microprocessor for processing the reflected ultrasonic and transmits to a monitor.

REFERENCES:
patent: 4366716 (1983-01-01), Yoshida
patent: 4741212 (1988-05-01), Rehwald
patent: 4768155 (1988-08-01), Takishita et al.
patent: 6062084 (2000-05-01), Chang et al.
patent: 6356346 (2002-03-01), Hagen et al.
patent: 2004/0024320 (2004-02-01), Karasawa et al.

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