Method and apparatus for detecting optimal endpoints in plasma e

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156345, 1566431, 20419233, H01L 2100, G01B 900

Patent

active

057387567

ABSTRACT:
An improved method for specifying and reliably detecting endpoints in processes such as plasma etching, where the signal-to-noise ratio has been severely degraded due to factors such as "cloudy window" and low ratio of reactive surface area to non-reactive surface area. The improved method of the invention samples signals produced by photo sensitive equipment, digitally filters and cross-correlates the data, normalizes the data using an average normalization value, and provides further noise reduction through the use of three modes of endpoint specification and detection. The three modes of endpoint specification and detection require a pre-specified number of consecutive samples to exhibit a certain behavior before the endpoint is deemed detected and the process terminated as a result. The three modes of endpoint specification and detection also permit a very fine control of the etch time by permitting the user to adjust the specified endpoint by gradations of the sampling period. The improved method of the invention is capable of being implemented on known apparatus.

REFERENCES:
patent: 4491499 (1985-01-01), Jerde et al.
patent: 4680084 (1987-07-01), Heimann et al.
patent: 4936967 (1990-06-01), Ikuhara et al.
patent: 5002631 (1991-03-01), Giapis et al.
patent: 5014217 (1991-05-01), Savage
patent: 5118378 (1992-06-01), Moroi et al.
patent: 5160402 (1992-11-01), Cheng
patent: 5160422 (1992-11-01), Cheng
patent: 5190614 (1993-03-01), Leach et al.
patent: 5343412 (1994-08-01), Birang
patent: 5405488 (1995-04-01), Dimitrelis et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for detecting optimal endpoints in plasma e does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for detecting optimal endpoints in plasma e, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for detecting optimal endpoints in plasma e will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-632042

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.