Method and apparatus for depositing a multilayered low dielectri

Coating processes – Direct application of electrical – magnetic – wave – or... – Plasma

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

427122, 427249, 4272556, 4272557, 438780, 438784, 438763, 438584, H05H 124, B05D 512, H01L 2102, C23C 1600

Patent

active

058042598

ABSTRACT:
A method and apparatus for forming a multilayer insulating film on a substrate involves forming a number of carbon-based layers on the substrate, each interlaid with layers of organic material, such as parylene. Preferably, the carbon-based layers are formed using a high-density plasma chemical vapor deposition system, although other CVD systems may also be used. The result is a multilayer insulating film having a low overall dielectric constant, excellent gap-fill characteristics, and desirable thermal properties.

REFERENCES:
patent: 4743327 (1988-05-01), De Haan et al.
patent: 4938995 (1990-07-01), Giordano et al.
patent: 5089290 (1992-02-01), Kleeberg et al.
patent: 5198263 (1993-03-01), Stafford et al.
patent: 5238705 (1993-08-01), Hayashi et al.
patent: 5270082 (1993-12-01), Lin et al.
patent: 5276537 (1994-01-01), Savant et al.
patent: 5290383 (1994-03-01), Koshimizu
patent: 5302420 (1994-04-01), Nguyen et al.
patent: 5368937 (1994-11-01), Itoh
patent: 5380557 (1995-01-01), Spiro
patent: 5424097 (1995-06-01), Olson et al.
patent: 5429995 (1995-07-01), Nishiyama et al.
patent: 5491002 (1996-02-01), Slutz
patent: 5512330 (1996-04-01), Dearnaley
patent: 5518766 (1996-05-01), Bigelow et al.
patent: 5563105 (1996-10-01), Dobuzinsky et al.
patent: 5614055 (1997-03-01), Fairbairn et al.
patent: 5638251 (1997-06-01), Goel et al.
patent: 5643640 (1997-07-01), Chakravarti et al.
F.S. Wing, The Complete Book of Decoupage; Coward-McCann, Inc., New York 1965 (no month); excerpt pp. 101-109.
D. Carl et al., "The Effect of O.sub.2 :C.sub.2 F.sub.6 Ratios and Low Frequency Power on the Gap Fill Properties and Stability of F-TEOS Films," DUMIC Conference, Feb. 21-22, 1995, pp. 234-240, Feb. 1995.
Neil H. Hendricks, "Organic Polymers for IC Intermetal Dielectric Applications," Solid State Technology, pp. 1-4, Jul. 1995.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for depositing a multilayered low dielectri does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for depositing a multilayered low dielectri, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for depositing a multilayered low dielectri will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1280059

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.