Method and apparatus for dechucking a substrate

Details Method and apparatus for dechucking a substrate Method and apparatus for dechucking a substrate

2008-05-20

2008-05-20

Sherry, Michael (Department: 2836)

Electricity: electrical systems and devices

Electric charge generating or conducting means

Use of forces of electric charge or field

Reexamination Certificate

active

10919457

ABSTRACT:
A method and apparatus for dechucking a substrate is provided. In one embodiment, a processing chamber is provided that includes a grounded chamber body having a substrate support assembly disposed in an interior volume. A dechucking circuit selectively couples the substrate support assembly to ground or to a power source. In another embodiment of the invention, a method for dechucking a substrate includes the steps of completing a plasma process on a substrate disposed on a grounded substrate support assembly, disconnecting the substrate support assembly from ground, and applying a dechucking voltage to the substrate support assembly.

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U.S. Appl. No. 09/593,848, filed Jun. 14, 2000 entitled: Method and Apparatus for Balancing an Electrostatic Force Produced by An Electrostastic Chuck, by Loo, et al.

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