Method and apparatus for creating strong interface between in-si

Coating processes – Direct application of electrical – magnetic – wave – or... – Plasma

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4272553, 438788, 438789, 438790, 438784, 438763, H05H 1400, H01L 2100, B05D 300

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058143777

ABSTRACT:
A method and apparatus for ramping down the deposition pressure in a SACVD process. The present invention also provides a method and apparatus for subsequently ramping up the pressure for a PECVD process in such a manner as to prevent unwanted reactions which could form a weak interlayer interface. In particular, the deposition pressure in the SACVD process is ramped down by stopping the flow of the silicon containing gas (preferably TEOS) and/or the carrier gas (preferably helium), while diluting the flow of ozone with oxygen. A ramp down of the pressure starts at the same time. The diluting of the ozone with oxygen, limits reactions with undesired reactants at the end of a process.

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