Method and apparatus for cooling semiconductor wafers

Details Method and apparatus for cooling semiconductor wafers Method and apparatus for cooling semiconductor wafers

1993-03-17

1994-09-13

Chambers, A. Michael

Heat exchange

With retainer for removable article

Electrical component

118725, F28F 700

Patent

active

053459997

ABSTRACT:
A semiconductor wafer cooling pedestal has a wafer cooling surface which includes both an electrostatic chuck portion to hold the wafer securely to the pedestal during wafer cooling and a thermal transfer portion to cool the wafer. The entire wafer cooling surface of the pedestal is mirror finished to provide intimate contact between the pedestal cooling surface and the wafer, thereby providing efficient thermal transfer from the wafer to the pedestal without the need for placing a thermal transfer medium, such as Argon or other inert gas, between the wafer and the pedestal.

REFERENCES:
patent: 4508161 (1985-04-01), Holden
patent: 4771730 (1988-09-01), Tezuka
patent: 4871687 (1989-03-01), Prince

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