Method and apparatus for cooling a resonator of a megasonic...

Details Method and apparatus for cooling a resonator of a megasonic... Method and apparatus for cooling a resonator of a megasonic...

2005-02-22

2005-02-22

Kornakov, M. (Department: 1746)

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

C134S001000, C134S034000, C134S042000, C134S184000, C366S127000

Reexamination Certificate

active

06857435

ABSTRACT:
A method for cleaning a semiconductor substrate with a sonic cleaner is provided. The method initiates by introducing a cooling fluid into an inner jacket region of a sonic cleaner to cool a sonic resonator positioned within the inner jacket region. Then, a cleaning agent is introduced into an outer jacket region of the sonic cleaner to clean a semiconductor substrate. Next, a cooling fluid/cleaning agent interface is defined at an orifice location between the inner jacket region and the outer jacket region. Then, sonic energy from the resonator is transmitted to the cleaning agent through the interface at the orifice. Next, the cleaning agent is applied to the semiconductor substrate.

REFERENCES:
patent: 5562778 (1996-10-01), Koretsky et al.
patent: 6644327 (2003-11-01), Mitsumori et al.

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