Method and apparatus for controlling temperature of a substrate

Coating apparatus – Gas or vapor deposition – With treating means

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C156S345270, C361S234000, C279S128000

Reexamination Certificate

active

07544251

ABSTRACT:
A pedestal assembly and method for controlling temperature of a substrate during processing is provided. In one embodiment, the pedestal assembly includes a support member that is coupled to a base by a material layer. The material layer has at least two regions having different coefficients of thermal conductivity. In another embodiment, the support member is an electrostatic chuck. In further embodiments, a pedestal assembly has channels formed between the base and support member for providing cooling gas in proximity to the material layer to further control heat transfer between the support member and the base, thereby controlling the temperature profile of a substrate disposed on the support member.

REFERENCES:
patent: 5838528 (1998-11-01), Os et al.
patent: 6035101 (2000-03-01), Sajoto et al.
patent: 6129046 (2000-10-01), Mizuno et al.
patent: 6256187 (2001-07-01), Matsunaga et al.
patent: 6310755 (2001-10-01), Kholodenko et al.
patent: 6664738 (2003-12-01), Arai et al.
patent: 6793767 (2004-09-01), Chu et al.
patent: 6853533 (2005-02-01), Parkhe
patent: 7221553 (2007-05-01), Nguyen
patent: 2002/0021545 (2002-02-01), Tatsumi et al.
patent: 2002/0050248 (2002-05-01), Pratt
patent: 2003/0155079 (2003-08-01), Bailey et al.
patent: 2003/0164226 (2003-09-01), Kanno et al.
patent: 2003/0230551 (2003-12-01), Kagoshima et al.
patent: 2004/0061449 (2004-04-01), Arai et al.
patent: 2004/0185670 (2004-09-01), Hamelin et al.
patent: 2004/0187787 (2004-09-01), Dawson et al.
patent: 2004/0195216 (2004-10-01), Strang
patent: 2004/0261721 (2004-12-01), Steger
patent: 2005/0042881 (2005-02-01), Nishimoto et al.
patent: 2006/0076108 (2006-04-01), Holland et al.
patent: 2006/0076109 (2006-04-01), Holland et al.
patent: 2006/0158821 (2006-07-01), Miyashita
patent: 2007/0102118 (2007-05-01), Holland et al.
patent: 2007/0139856 (2007-06-01), Holland et al.
patent: 2007/0258186 (2007-11-01), Matyushkin et al.
patent: 2585414 (2003-11-01), None
patent: 0917770 (1997-01-01), None
patent: 10209257 (1998-08-01), None
Raw machine translation of JP 10209257 (10 pages).
Translation of Chinese Office Action for CN Application No. 200510116536.0, consists of 10 unnumbered pages.
Claims co-pending U.S. Appl. No. 11/740,869, filed Apr. 26, 2007.
Claims co-pending U.S. Appl. No. 11/778,019, filed Jul. 14, 2007.
International Search Report, Aug. 3, 2007.
Wail, R.K.. Monitoring residual and process gases in PVD processes: The importance of sensitivity. Micromagazine, Jun. 1997.
Second Office Action for Chinese Application No. 200510116536.0, May 30, 2008, consists of seven pages (1-3 and 1-4) (APPM/9259 CN)—provides a concise explanation of relevance for B1.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for controlling temperature of a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for controlling temperature of a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for controlling temperature of a substrate will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4092896

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.