Method and apparatus for connecting a bondwire to a bondring nea

Details Method and apparatus for connecting a bondwire to a bondring nea Method and apparatus for connecting a bondwire to a bondring nea

1998-01-06

2000-02-01

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257701, 257786, H01L 2352

Patent

active

060206314

ABSTRACT:
An integrated circuit device package. The package includes a package substrate having a conductive bondring disposed thereon. A via is electrically coupled to the bondring. A conductive bondring extension is also disposed on the package substrate. The bondring extension is electrically coupled to the bondring and the via and extends away from the bondring and the via.

REFERENCES:
patent: 5483099 (1996-01-01), Natarajan et al.
patent: 5723899 (1998-03-01), Shin

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