Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1998-01-06
2000-02-01
Whitehead, Jr., Carl
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257701, 257786, H01L 2352
Patent
active
060206314
ABSTRACT:
An integrated circuit device package. The package includes a package substrate having a conductive bondring disposed thereon. A via is electrically coupled to the bondring. A conductive bondring extension is also disposed on the package substrate. The bondring extension is electrically coupled to the bondring and the via and extends away from the bondring and the via.
REFERENCES:
patent: 5483099 (1996-01-01), Natarajan et al.
patent: 5723899 (1998-03-01), Shin
Faatz Cindy T.
Intel Corporation
Jr. Carl Whitehead
Potter Roy
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