Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2007-03-05
2008-12-02
Pert, Evan (Department: 2826)
Semiconductor device manufacturing: process
With measuring or testing
C438S016000
Reexamination Certificate
active
07459319
ABSTRACT:
A method and apparatus for testing and characterizing features formed on a substrate. In one embodiment, a test structure is provided that includes a test element having a first side and an opposing second side. A first set of one or more structures defining a first region having a first local density are disposed adjacent the first side of the test element. A second set of one or more structures defining a second region having a second local density are disposed adjacent the second side of the test element. A third set of one or more structures defining a third region having a first global density are disposed adjacent the first region. A fourth set of one or more structures defining a fourth region having a second global density are disposed adjacent the second region.
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Duane Michael P.
Smayling Michael C.
Yang Susie Xiuru
Applied Materials Inc.
Patterson & Sheridan LLP
Pert Evan
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