Method and apparatus for both mechanically and electrostatically

Details Method and apparatus for both mechanically and electrostatically Method and apparatus for both mechanically and electrostatically

1996-12-04

1999-03-23

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429809, 156345, 118723E, 118728, 118729, C23C 1450

Patent

active

058854282

ABSTRACT:
Method and apparatus for retaining a workpiece in a process chamber of a semiconductor wafer processing system. The apparatus has a mechanical clamp for clamping the periphery of the workpiece to a pedestal and an electrostatic clamp for clamping the center of the workpiece to the pedestal.

REFERENCES:
patent: 4565601 (1986-01-01), Kakehi et al.
patent: 4968374 (1990-11-01), Tsukada et al.
patent: 5350479 (1994-09-01), Collins et al.
patent: 5591269 (1997-01-01), Arami et al.

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