Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2008-05-13
2008-05-13
Nguyen, Thanh (Department: 2813)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S612000, C438S613000, C257SE23033
Reexamination Certificate
active
07371675
ABSTRACT:
A method and apparatus for bonding a wire and a wire bond device formed by the same are disclosed. The method includes providing a carrier with at least a first pad, providing a semiconductor chip having at least the second pad, the at least second pad being smaller than the first a pad, forming a conductive stud bump on the second pad, and forming a bonding wire that has two terminal portions, which are respectively bonded to the first pad and the stud bump to electrically connect the first pad and the second pad. The stud bump is bonded to the second pad by a ball bonding method which uses a wire that has an approximately smaller diameter than the bonding wire. Further, a prominence formed on one end of the terminal portions is provided which has an approximately larger diameter than the stud bump.
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An Sang-Ho
Kang In-ku
Yang Sun-Mo
Harness & Dickey & Pierce P.L.C.
Nguyen Thanh
Samsung Electronics Co,. Ltd.
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