Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – For liquid etchant
Reexamination Certificate
2006-04-11
2006-04-11
Deo, Duy-Vu N. (Department: 1765)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
For liquid etchant
C438S691000, C438S692000
Reexamination Certificate
active
07025854
ABSTRACT:
A method and apparatus is disclosed for polishing a semiconductor wafer. A polishing pad including a first surface and a semiconductor wafer including a second surface are aligned to each other. To allow alignment of an axis of rotation of the surfaces, at least one of the first and second surfaces includes an adjustable axis of rotation. After the axis of rotation of the first and second surfaces is aligned, the adjustable axis of rotation is set, preferably with a magneto-rheological fluid or similarly acting material, to maintain a fixed position. Thereafter, the polishing pad is utilized to polish the semiconductor wafer.
REFERENCES:
patent: 4450652 (1984-05-01), Walsh
patent: 5823854 (1998-10-01), Chen
patent: 5839944 (1998-11-01), Jacobs et al.
patent: 5851135 (1998-12-01), Sandhu et al.
patent: 5885135 (1999-03-01), Desorcie et al.
patent: 5957750 (1999-09-01), Brunelli
patent: 6121144 (2000-09-01), Marcyk et al.
patent: 6186872 (2001-02-01), Kimura et al.
Peter Godwin, “The Car That Can't Crash”, The New York Times Magazine, Jun. 11, 2000.
Boyd John M.
Owczarz Aleksander
Saldana Miguel
Brinks Hofer Gilson & Lione
Deo Duy-Vu N.
Lam Research Corporation
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