Method and apparatus for adjustment of spacing between wafer and

Details Method and apparatus for adjustment of spacing between wafer and Method and apparatus for adjustment of spacing between wafer and

1993-07-16

1996-07-30

Breneman, R. Bruce

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20419212, 20429803, 20429811, 20429815, 20429823, 20429829, 118728, 118500, 414217, 414218, C23C 1454, C23C 1450, C23C 1604, B65G 2500

Patent

active

055408214

ABSTRACT:
A heater and pedestal actuator is provided to actuate the pedestal of a deposition chamber from a first position wherein a wafer may be placed thereon to a second position adjacent to the deposition target. To adjust the inward travel of the heater to compensate for target erosion, the actuator includes a worm drive apparatus driven by a stepper motor. The worm drive is pitched, and the stepper motor is selected, to allow fine movement of the heater on the order of less than 0.01 mm for each arcuate step of the stepper motor. A computer is used to actuate the stepper motor, and cause additional stepper motor actuation, to increase the travel of the heater toward the target to compensate for target erosion. Additionally, the computer may vary the speed of the worm drive rotation, to create different heater travel speeds within the chamber.

REFERENCES:
patent: 4382739 (1983-05-01), Mack et al.
patent: 4513855 (1985-04-01), Fletcher et al.
patent: 4590380 (1986-05-01), Tamaki
patent: 4619573 (1986-10-01), Rathmann et al.
patent: 4632624 (1986-12-01), Mirkovich et al.
patent: 4746256 (1988-05-01), Boyle et al.
patent: 4801241 (1989-01-01), Zajac et al.
patent: 4861222 (1989-08-01), Mirkovich
patent: 4872947 (1989-10-01), Wang et al.
patent: 4894132 (1990-01-01), Tanaka
patent: 4902531 (1990-02-01), Nakayama et al.
patent: 4915564 (1990-04-01), Eror et al.
patent: 4923584 (1990-05-01), Bramhall, Jr. et al.
patent: 5051054 (1991-09-01), Wagner et al.
patent: 5098198 (1992-03-01), Nulman et al.
patent: 5108570 (1992-04-01), Wang
patent: 5131460 (1992-07-01), Krueger

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