Metal-oxide-semiconductor transistor and method of forming...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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Details

C438S258000, C438S682000, C257SE21421, C257SE21622

Reexamination Certificate

active

07494878

ABSTRACT:
A method of manufacturing a MOS transistor device. First, a semiconductor substrate having a gate structure is prepared. The gate structure has two sidewalls and a liner on the sidewalls. Subsequently, a stressed cap layer is formed on the semiconductor substrate, and covers the gate structure and the liner. Next, an activating process is performed. Furthermore, the stressed cap layer is etched to be a salicide block. Afterward, a salicide process is performed to form a silicide layer on the regions that are not covered by the stressed cap layer.

REFERENCES:
patent: 2005/0059228 (2005-03-01), Bu et al.
patent: 2005/0218455 (2005-10-01), Maeda et al.
patent: 2007/0202653 (2007-08-01), Hoentschel et al.
patent: 2007/0235823 (2007-10-01), Hsu et al.
patent: 2008/0003734 (2008-01-01), Chuang et al.

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