Metal CVD process with post-deposition removal of alloy produced

Details Metal CVD process with post-deposition removal of alloy produced Metal CVD process with post-deposition removal of alloy produced

1994-02-07

1995-05-09

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

437190, 437192, B44C 122, C23F 100

Patent

active

054136695

ABSTRACT:
The invention is a method of reducing alloy particle contamination in processing a semiconductor workpiece having an underlying layer, a metal adhesion layer on the underlying layer and a metal contact layer overlying the adhesion layer, a peripheral portion of the adhesion layer near an edge of the workpiece being exposed and containing an alloy formed during deposition of the metal contact layer, the method including subjecting the workpiece to an etching agent so as to remove a portion of the metal contact layer and at least a portion of the alloy. In a preferred embodiment, the metal contact layer is thicker than the metal adhesion layer so that the method removes a large proportion of the alloy and a smaller proportion of the metal contact layer.

REFERENCES:
patent: 5110408 (1992-05-01), Fujii et al.

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